Various Issues Due To Exposed SMI Handler in AmdPspP2CmboxV2. The first issue can be leveraged to bypass the protections that have been put in place by previous UEFI phases to prevent direct access to the SPI flash. The second issue can be used to both leak and corrupt SMM memory thus potentially leading code execution in SMM

Huawei Matebook D16(Model: CREM-WXX9, BIOS: v2.26), As the communication buffer size hasn’t been properly validated to be of the expected size, it can partially overlap with the beginning SMRAM.This can be leveraged by a malicious OS attacker to corrupt data structures stored at the beginning of SMRAM and can potentially lead to code execution in SMM.

Huawei Matebook D16(Model: CREM-WXX9, BIOS: v2.26) Arbitrary Memory Corruption in SMI Handler of ThisiServicesSmm SMM module. This can be leveraged by a malicious OS attacker to corrupt arbitrary SMRAM memory and, in turn, lead to code execution in SMM

Huawei Matebook D16(Model: CREM-WXX9, BIOS: v2.26. Memory Corruption in SMI Handler of HddPassword SMM Module. This can be leveraged by a malicious OS attacker to corrupt data structures stored at the beginning of SMRAM and can potentially lead to code execution in SMM.

Some Huawei smart speakers have a memory overflow vulnerability. Successful exploitation of this vulnerability may cause certain functions to fail.

Cracking vulnerability in the OS security module Impact: Successful exploitation of this vulnerability will affect availability.

Cracking vulnerability in the OS security module Impact: Successful exploitation of this vulnerability will affect availability.

NULL pointer access vulnerability in the clock module Impact: Successful exploitation of this vulnerability will affect availability.

Race condition vulnerability in the binder driver module Impact: Successful exploitation of this vulnerability will affect availability.

Privilege escalation vulnerability in the account module Impact: Successful exploitation of this vulnerability will affect availability.